YOUR PROFILE:
Organization Name:
Contact Person: *required
Address:
Address:
Phone: *required
Fax:
Email Address: *required
Just have a general question or want to send us a quick note? Ask it in the area below and then scroll to the bottom of the page and click the Submit button. Otherwise, please continue down and complete the entire form for an accurate quote on the system you are looking for.
Describe your system in a few sentences or ask questions here:
*required
PROCESS DETAILS:
What Process(s) do you want your system for?
For a Combination system, select all that apply:
Thermal Evaporation
E-Beam Evaporation
Sputter Desposition
Etching System
Ion Beam System
Process description: Please include a brief description of the process(s) you plan to perform. If you selected a Combination system, be sure to give descriptions of each process.
SUBSTRATE DETAIL S:
Substrate Size:
Substrate Quality:
Substrate Shutter Required?:
Select One
Yes
No
Materials to be deposited:
Select One
Di-electrics
Metals
Organics
Polymers
Thickness Desired (Please specify units):
Uniformity Required (%) +/-3% +/-5%
If multilayer depositions are required give details:
Type of deposition:
Your Choice
Sequential
Simultaneous
Give Details. If Reactive Deposition is required, give details:
Any special requirements of the film:
SYSTEM REQUIREMENTS:
CHAMBER REQUIREMENTS:
Chamber Size:
Chamber Shape:
Chamber Material:
Load Lock Chamber?
Select One
Yes
No
Viewport Requirements
Size:
Material:
Quantity:
Type of Lifting on Chamber/Top Plate
(only for cylindrical chamber):
Select One
Hinged Lifitng
Hoist Lifting
No Preference
SUBSTRATE STAGE REQUIREMENTS:
Size
Substrate Rotation Required?
Select One
Yes
No
Rotation (rpm) Planetary?
Select One
Yes
No
Multi axis?
Select One
Yes
No
Water cooled substrate stage?
Select One
Required
Not Required
Other requirements
Substrate Temperature Control?
Select One
Required
Not Required
Temperature (o C) Accuracy (+/- o C) Uniformity (+/- o C)
Simple
PID
Thickness monitor?
Select One
Required
No
If so, specify type and requirements:
SPUTTERING GUN, TARGET | SOURCE REQUIREMENTS:
Size
Standard
Magnetic UHF
Flex
Power Requirements
Select One
DC
RF
Both
Gasses & Flow to be used:
Argon
Select One
50 sccm
100 sccm
200 sccm
Nitrogen
Select One
50 sccm
100 sccm
200 sccm
Oxygen
Select One
50 sccm
100 sccm
200 sccm
Other
Select One
50 sccm
100 sccm
200 sccm
Micrometer valve MFC
THERMAL EVAPORATION REQUIREMENTS:
Thermal Evaporation Source (type)
Port Quantity
Crucible Capacity (cc)
Power (kW and V/A)
Type of control required Variac SRC
ELECTRON BEAM EVAPORATION REQUIREMENTS:
No of pockets:
Select One
One
Two
Four
Other
If other, specify
Liners Required?
Select One
Yes
No
If yes, specify
Capacity (cc)
Power (kW)
Sweep Supply
Select One
Yes
No
Any other requirements
VACUUM SYSTEM REQUIREMENTS:
Turbo-Molecular/Mechanical pump combination
Diffusion pump/Trap/Mechanical pump combination
Cryopump/Mechanical pump combination
Mechanical Pump Oil Seal or Dry
Ultimate (Base) vacuum required (Torr)
Process vacuum anticipated (Torr)
Pump down time (min)
Cleanliness/Contamination consideration
Gauge Range (Torr)
Full range
Capacitance Manometer
Extra ports required (explain)
Operation
Manual
Semi-Automatic
Computer-controlled
GENERAL:
Expected Order Date (mm/dd/yyyy)
Training of your personnel is required.
Is Installation at your site required?
Select One
Yes
No
Budget, if known ($US)
Torr International, Inc.
12 Columbus Street , New Windsor, NY 12553
Tel: (845) 565-4027 or (866) MAC-TORR
Fax: (845) 561-7731
©1989 - 2007 Torr International, Inc. All Rights Reserved.