Compact Research Coater

CRC-600

The CRC-600 consists of a vacuum system including a 80 l/s turbo-molecular pump, a rotary vane mechanical pump, a quartz crystal thickness monitor, a stainless steel chamber with viewport, one planar magnetron sputtering source, one 600W DC power supply and one 600W RF power supply.

Philosophy of Design:

The following coating system which utilizes magnetron sputtering, as a source of deposition is an important all around tool in the fields of Nanotechnology. Such as deposition of metals and dialectics used for semiconductor research, optics and related fields. Materials such as Al, Ti, ITO, Au, Al2O3, SiO2, etc can be deposited. Dielectric materials can be deposited provided optional RF generator is ordered. The system is also suitable for production of small size samples.

This system consists of the following:

Process Chamber

The process chamber is made of stainless steel 304 with dimensions 200mm D x 250 mm H. It has a top opening door for easy access to the wafer stage as well as to the sputter gun for changing targets. The chamber has a 100mm view port for process monitoring. The adjustable sputter gun is mounted on a quick coupling on the top plate and the turbo pump is installed on the bottom plate. The chamber has various other ports for gas inlet, venting, vacuum gauge etc.

Vacuum System

Consists of a turbo pump, 70 l/s, turbomolecular with a drag stage to handle sputtering process pressures, backed by a matching double stage mechanical pump. A turbo vent has also been provided. A full range vacuum gauge will be provided which can measure from 760 Torr to 10 -8 Torr. The pumping system will be completely automated for one-touch operation. Optional dry mechanical pump is available.

Sample/Wafer Stage

A stationary 100mm (4”) sample stage is provided for placing one 100mm sample or multiple smaller samples. This stage has optional provision to be heated up to 300 degrees Celsius by a PID controller. The sample stage can rotate from 0 to 20 RPM for better uniformity of deposited material.

Gas Delivery System

The gas delivery system will consist of a mass flow controller with shut off valve and a power supply read out for Argon. Another optional mass flow controller can be added for gases such as N2 and O2 for the purpose of reactive sputtering.

Sputter Gun

A 2" Angstrom Sciences’ water-cooled magnetron sputter gun. The gun can be operated with both DC and RF power supplies. Most metals, alloys and oxides can be used, although some of the oxide targets will require a copper backing plate. Target mounting is easy and very thin targets (minimum thickness 0.254mm) can also be used. This will be helpful when precious metals are being sputtered. A manual shutter will also be provided for the gun. Moreover, the sputter gun can be pulled in and out by releasing the quick coupling to adjust the distance between the sample and source.

Power Supplies

A 600 W DC Power Supply with a digital display of voltage and current with a HV enable switch is provided. An optional, 300 W, 13.56 MHz RF power supply with manual matching network is provided. Forward and reflected power will be digitally displayed on the front panel.

Thickness Sensor/Monitor

A quartz crystal thickness sensor will be suitably located inside the chamber with thickness monitor on the front panel, which will digitally display the rate of deposition and thickness. This can be used for process termination with a preset thickness or preset time for deposition. Thickness monitor is equipped with RS 232 for PC upgrading of the system.

The system is complete and ready to be used for coating all types of metals on substrates up to 4” in diameter. The system is provided with a Ti target for testing and depositing Titanium.

Available Options

• RF power supply and manual matching network to deposit dielectrics such as SiO2.
• Box Chamber – same system as above, but with a box chamber (12”x12”x14”) with front door opening
• Heater for Substrate – Up to 300ºC with backside quartz lamp and temperature control.
• Automatic matching network in place of manual.
• Dry pump in place of oil sealed pump.
• Rotation of substrate with DC motor – 0-20RPM and tilted magnetron gun