Compact Research Coater – CRC-300
Click to view our CRC-300 Magnetron Sputtering System
Features
The CRC-300 replaced the CRC-150 and also uses a DC and RF compatible water-cooled planar magnetron source, and a water-cooled stage to protect extremely heat sensitive samples like polycarbonate membranes. The system's optional stage heaters can rapidly and uniformly heat a substrate to a maximum of 600°C during deposition for improved film adhesion and uniformity, as well as to control grain size of the deposited films. The optional CRC-300 DC etch mode provides a gentle, low power, plasma glow discharge precleaning, and an RF etch option can be used for specific etch applications or for removal of bonded surface material prior to coating.
Excellent Film Quality
High rate planar magnetron sputtering produces uniform, adherent thin films. The new source shutters protect the sample surface from target oxide contamination during a pre-sputter run.
Highly Versatile, Space-Saving and Affordable
A wide variety of materials can be deposited, including: aluminum, carbon, chromium, gold, Teflon©, SiO2, tantalum, tungsten and titanium. And since it is completely manually controlled, the compact tabletop sputtering system is easily adaptable and also economical.
Process Efficiency
It takes less than thirty seconds to change a solid disc target, so the CRC-300 is easily reconfigured for applications requiring a different materials depositions 60 l/sec. Turbomolecular vacuum pump allows 10-6 Torr range base vacuum. Operating vacuum of low 10-5 Torr reached in 15 minutes.
Low Maintenance
The turbomolecular pump needs zero maintenance while the external roughing pump just requires routine oil changes. Chamber cleaning is the only programmed maintenance required on a routine basis.
Many Options are available including:
Substrate stage heating, RF Power, film thickness monitoring, water-cooled stage and other options to customize the CRC-300 for your application.
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