MagSput™ Magnetron
Sputtering System
Setting New Standards
in Thin Film Deposition
The MagSput™ series Sputtering Systems are flexible planar magnetron sputtering system designed specifically for the R&D and prototype production. The system can be used to develop the deposition process for a wide variety of applications: multi-layer optical coatings, sensor devices, solar cells, fuel cells, thin film research, superconductor research, ASICs, MEMs, magnetic devices, biomedical research, CV dot mapping...
Since targets can be changed quickly, the MagSput™ series system is easily reconfigured for applications requiring a different series of deposited materials. The system processes wafers up to 12" in diameter, and accommodates odd-size substrates. Further, due to multi-gun capability, co-sputtering, sequential sputtering without breaking vacuum, and reactive sputtering (with active gas mixtures) are possible, leading to a lot of versatility. The stand-alone guns with special mounting enable angular adjustment. The Labview™ based software brings a state of the art “user friendly” computer control to the tabletop-sputtering realm. The software's automatic process control ensures a more efficient deposition as well as ease of operation. The manual option enables easy start-up and troubleshooting. Click to download literature on our: Problems opening our files?
|
Philosophy of Design:
)
The Magnetron Sputtering system consists of a vacuum system including a maglev hybrid turbomolecular pump, a mechanical pump, a full PC control system, a stainless steel chamber with viewport, four sputtering guns, one gun magnetic material deposition, a gas delivery system, one 1200 W DC power supply, one 600 W RF power supply, and a shuffling sample stage.
Given the requirements of Multi-Gun Sputtering involving sequential deposition from any of the sources/guns, a D shaped box Process Chamber is the most convenient choice. This enables easy access to the guns to change targets as well as to the substrate for sample change. Further, for the size of the chamber and the variety of gadgets that are going into the chamber, a turbo pump of about 300 l/s will enable low 10 -6 Torr vacuum to be reached in less than 30 minutes; 10 -7 range to be reached as an ultimate vacuum.
It is important to shield the guns from one another and to provide heat shield for the substrate as to have a trouble-free and cross-contamination free operation. Given the number of guns, gas inlets, substrate features and power supplies on top of RF etch capability, substrate heating or cooling, the system is made such that an upgrade to PC Control is also possible.
This system consists of the following:
Process Chamber
Electro-polished stainless steel chamber of 16”X14”X16” size, D shaped, with a full curved opening front door, giving access to the sputter guns for changing targets, substrate holder and all other accessories like thickness sensor, thermocouple, gas inlets, etc.; also having a 6” view port with shutter for process monitoring. The back plate will carry the gate valve, turbo pump and gauges, vent, gas inlets etc. Top plates carrying the 2 sputter guns; the base plate carrying the substrate holder with rotary motion (0-20 rpm), with heat shields; the side plates are free for any other fixtures.
Vacuum System
The vacuum system will consist of a ~300 l/s turbo pump and a matching double stage rotary pump with a foreline trap. With this pumping arrangement, a base vacuum in the range of 10 -6 Torr can be regularly achieved. Ultimate base vacuum in the range of 10 -7 Torr is achievable if overnight pumping is done. A cryo pumping sections is noted as an optional part in this quotation.
Substrate Holder with Heating
The sample stage will be made of stainless steel, circular in shape (15cm dia). This can hold a single 6” wafer or multiple samples/wafers of small size and various shapes. Convenient threaded holes and springs will be used to hold any round or irregular shape samples against the substrate holder. Backside quartz lamp heating arrangement will be provided to heat the sample stage up to 400 0 Celsius. The temperature will be controlled through a PID controller and will be digitally on front panel. The sample stage will have provision for rotation up to 20 rpm for better uniformity.
Gas Delivery System
This will consist of two mass flow controllers with shutoff valves for Argon and Oxygen. A unique gas shower ring will be provided inside the chamber for uniform gas distribution during sputtering process.
Instrumentation
A full range combination cold cathode and Pirani gauge measuring from 760 to 10 -8 Torr is provided. This gauge can detect the base vacuum and also is suitable for Argon pressure during sputtering process.
Sources
Quantity of four, 3” Angstrom Sciences magnetron guns, each with innovative integral shutter and shield for depositing metals and dielectric target materials will be installed. The guns are at a tilt angle and focus at the center of the substrate stage. The guns are retractable up to 6” while keeping the focal point the same. Also the substrate stage with the heater height can be varied up to 2”. This feature allows some investigators to focus each gun at some radial distance other than the center of the substrate stage. A special tool will be provided to accurately adjust the distance and focal point of each gun with respect to substrate stage. The first and second guns are used for metals deposition such as Cu, Ti, Pt, etc. The third gun is used for dielectric materials such as SiO2, Si3N4. The fourth gun is used for magnetic such as Ni & Fe.
Power Supplies
ntity of one RF power supplies (13.56 MHz RF) and one DC supply will be provided. The RF power supply is capable of delivering up to 600W. The RF supply is with an auto-matching network in order to minimize the reflected power. Both the total and reflected power is shown digitally on displays. The DC power supply is rated to deliver up to 1200W power necessary for 3” magnetron guns.
RF Etch Capability
2 Liter per minute at 15°C and 40/50 psi. (A water chiller will be required if long process times are intended.)
PC Control Including Thickness Sensor
The entire operation-vacuum process, control, safety and data collection and storage including data from the thickness sensor will be automatically through a PC with Labview Pro2005 Software. Manual override for initial start-up and later maintenance is provided. A second manual mode through PC is also possible. The package will include a computer with flat panel monitor keyboard, mouse, etc. Since the hardware and interface are through field point hardware it will also be possible to use other host computers. The thickness sensor hardware and software is integrated into the PC control system.
The system will be CLEAN ROOM COMPATIBLE.
Available Options
- Process Chamber: Additional View ports & larger dimensions available
- Vacuum System: 300 - 3000 l/sec, turbo or cryopump, dry or oil rotary pump
- Vacuum Gage: Cold cathode or hot cathode ionization gauge
- Magnetron Source: Choose the size of the guns and how many
- Power Supply: DC and RF Power Supplies available to 1000W and higher
- Substrate Stage: Any size available, adjustable height
- Etch Capability: Optional isolated stage can give etching and cleaning capabilities
- Stage Tilt & Rotation: Azimuthal and polar rotation, external or in vacuum stepper Motors
- Stage Heating: Quartz lamp heater up to 800 degrees Celsius
- Thickness Monitor: Choose quartz crystal or optical thickness monitor
- Automatic Control: Completely PC compatible
- Extended Warranty: Renewable extended warranties available for any term