Torr International Services LLC manufactures Reactive Ion Etchers designed for etching films of oxides, nitrides, polymers and more. Our standard RIE Series Plasma Etching System accommodates wafers/samples of up to 200mm diameter . Our custom RIE systems can handle variety of sample sizes based on geometry and research Needs.
An Inductively Coupled Plasma (ICP) RIE, is generated with an RF power source inducing a plasma by induction to generate anisotropic etching, while in a basic RIE etch system the RF is directly connected to the sample stage acting as the electrode, generating an isotropic plasma. The ICPRIE sometime is called barrel etching.