(Etching requirements/needs if chosen above)
Most Common Size of your Substrate Sample and the Material of Sample most commonly deposited on, Rotation only, Rotation and Heating, Substrate cooling only-water or LN2, (plasma etched, reactive ion-etched or ion-milled off from if specification is needed).
(Etching requirements/ needs if chosen above)
Types of Deposition Sources required, Number of Sources desired, Type of Power Supplies preferred or required, (Etch Rates, CCP or ICP Plasma requirements, Ion Beam Etching, DRIE needs, Oxygen Asher).
(Etching requirements/ needs if chosen above)
Final Thin-Film Thickness, Deposition Rates, Uniformity requirements, Expected Throw Distance between source and sample, Multilayer Sequential/Simultaneous Deposition requirements, Type of Materials to be deposited, (Common Gas chemistries required for etching, (known plasma etch process parameters, Corrosive gas compatibility requirements, your existing laboratory/facility safety standards for scrubbing noxious effluents).
(Etching requirements/ needs if chosen above)
Base Vacuum required, Process vacuum range required, Type of High Vacuum Pumping System, Turbo, Cryo, Diffusion Pumps, roughing/backing pumps, Oil or Dry, traps or mist filters, (Corrosive Compatible Turbo pumping system, Fomblin-Prepped mechanical pump, all stainless steel roughing lines).
Manual Controlled, PLC controlled, Semi-automated Deposition control, Fully Automated PC control
(Etching requirements/ needs if chosen above)
Unique Custom Engineered solutions to various deposition research needs, special Substrate Sample Carriages, Load Lock requirements, Reel to Reel deposition solutions, Pilot-production capabilities, Closed-Loop Water Chillers, Water cooled vacuum Chambers, Air Compressors with CDA compatible filter stages, Foreline Traps, Oil Mist filters, (Gas Scrubbers, End point-detection)