Which Deposition Technique?

WHICH DEPOSITION TECHNIQUE TO CHOOSE?: THERMAL, E-BEAM or SPUTTERING?
TECHNIQUE
Resistance Heated Sources, Filaments, Boats or Ovens
Electron Beam
Deposition
Sputtering
ADVANTAGES & CONSIDERATIONS

- Simplistic Arrangement
- Low-Cost Setup
- Rate Control is Difficult
- High Deposition Rate
Dependent Upon Source Material
- Evaporation Rate is Limited
Based Upon Evaporation
- Temperature of Source Material
Source Life Limited
- Desirable Rate Control
- Limited Contamination
of Source Material
- High Temperature Source
- Material Can Be Used (Including W & C)
- Increased Costs Considering Size of Source, Power Supply & Control System

- Technology of Sputtering is
Versatile & Well Developed
- Varying Vacuum Arrangements are Achievable
- Excellent Reproducibility
- Good Rate Control Dependent Upon Source
Size & Power Applied
- Adaptable to Any Size &
Material of Substrate Used
- Target Material Is Partially Consumed
- Increased Costs Dependent Upon Size
of Source & Type of Power Source Used